As we all know, Samsung will officially release the Galaxy S9 series on MWC this year. Now, its package box with specification has already been exposed on the Internet.
Recently, a Chinese weibo user has exposed the rendering of the Samsung Galaxy S9’ back case on weibo. From the rendering, the phone has narrowed its forehead and chin. On the back, It comes with the vertical dual cameras setup, with fingerprint reader right below the setup. Besides, the smartphone is expected to be the first smartphone which is powered by Qualcomm Snapdragon 845 in the world. It is said that the S9 is expected to feature a 5.8-inch 2K touchscreen. The phone is expected to feature the 12MP and 12MP dual camera setup which has aperture F/1.5 and F/2.4. The phone will come with 4GB of RAM and 64GB of ROM. It is also estimated to comes with 8GB of RAM and 256GB of ROM.
The S9 will feature iris recognition and wireless charging. And it will support rated IP67 dust and water resistant function. Its earphones will be made by AKG.