Last month, we reported that Honor had applied for several new trademarks, including the ‘Honor Magic Fold’ trademark. This suggests that Honor is about to launch a new foldable phone, and recent news indicates that the device’s release date is very close.
This morning, Digital Chat Station shared the latest supply chain news, which revealed that Honor’s upcoming foldable phone will feature an 8-inch main screen and an approximately 6.5-inch secondary screen. The supplier will be BOE, the famous Chinese display manufacturing company.
In addition, some analysts reported that the Honor foldable phone is expected to be launched soon. It will use an inward-folding screen design and display panels supplied by Visionox and BOE.
Also, we can infer that this foldable phone will feature the Snapdragon 888 or 888+ chipset, as the company is focusing on using Qualcomm chipsets rather than Kirin chipsets.