Vivo mobile Phone Vivo X6 Plus

Vivo X6 Plus Teardown

David May 1, 2018

0 2 minutes read

In this guide, I’ll explain how to disassemble Vivo X6 Plus to remove the back cover, speakers, battery, camera and motherboard, refer to this guide. You can repair your Vivo X6 Plus.

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Specification:
OS: Android OS 5.1
CPU: MediaTek MT6752, 1.7GHz
Display: 5.7-inch Super AMOLED, 1920×1080, 386ppi
RAM: 4GB
ROM: 64GB
Battery: 3000mAh
Camera: 13MP rear camera f/2.0, 5MP front camera f/2.0
HIFI: ES9028+ES9603 chips

Vivo X6Plus has been officially on sale on December 14. This product is one of the highlights is the use of the world premiere of ES9028Q2M + ES9603Q combined audio chips.

Remove two screws next to the Micro USB port.

Remove SIM card tray.

Open up the display assembly a little with a sucker, the insert a guitar pick, sliding the pick, releases all the snaps.

With the back cover was removed, you can see the back cover with a full metal design, a high degree of integration.

A special feature is that the back cover is pressed fingerprint identification directly connected by metal contacts, and no cable, so it is very convenient to remove the back cover (but back cover’s snap is very tight, very difficult to disassembly),

For security purposes, before to further disassembly, we should disconnect the battery connector, X6 Plus battery connector covered by a metal cover, so that cable is not easy to loosen, the reliability is indeed very good, but it also increases the weight of the phone.

Vivo X6 Plus comes with a 3.8v, 3000mah Li-polymer battery.

Now remove the metal cover and disconnect the yellow cable.

Disconnect button cable and antenna.

Remove camera’s metal cover. It is fixed by a screw (the screw covered by fragile stickers, if you damage it, you will avoid warranty.).

Remove SIM card cover.

Remove all screws securing the motherboard. You can remove the motherboard.
We can see the motherboard was covered with graphite and metal shield.

The back of the motherboard is also covered with a metal shield and a copper sheet.
Under the copper sheet are SoC and RAM.

X6 Plus’s 13MP camera and 8MP front camera

Remove the graphite sticker. You can see almost frenzied metal shield, this approach is estimated to HiFi system service, it can be subject to as little interference.

Remove SoC’s copper sheet. You can see the pink grease on SoC.

Remove the speaker board module. The board integrated a speaker and a vibrator.

X6 Plus metal shield is welded on the motherboard. We need to use a heat gun to remove them.

Front side

Back side

MTK’s MT6752, eight-core Cortex-A53 1.7GHz, is a 64-bit SoC, 28nm HPM process, with the Mali-T760MP2 graphics processor. Under the SoC, also enclosing a 4G memory chips.

Samsung KMRC10014M-B809 64G ROM

MTK MT6169V RF chip

NXP TFA9890A audio Amplifier

This is ESS’s ES9028Q2M, and it is ES9028 series of the first chip, X6 Plus is the world’s first phone which use the chip. Its provides 129dB signal to noise ratio, distortion – 120dB.