Honor CEO (Zhao Ming) recently revealed at the Honor 50 series launch event that the Honor Magic 3 will feature the Snapdragon 888 Pro chipset and is planned for release in the third quarter of 2021.
As revealed by the codename SM8350 Pro, the chipset will be named Snapdragon 888 Pro. It is worth mentioning that the codename for the Snapdragon 888 is SM8350.
According to recent reports, the 888 Pro will include a single super-large core, three large cores, and four small cores. The CPU frequency will be overclocked to 3.0 GHz, and several smartphone manufacturers are already testing it.
However, Digital Chat Station stated that the Snapdragon 888 Pro will not be featured in many upcoming phones, even though some manufacturers have yet to acquire it, as the performance improvement is too limited.
According to sources, the chipset is expected to be released in the third quarter of 2021, although Qualcomm’s next-generation chipset is not far away.
As a result, many manufacturers may be unable to launch devices powered by the chipset due to R&D costs and product line limitations.