Honor has officially announced that the company is about to release its first-ever foldable phone. Surprisingly, there have been no leaks or rumors ahead of the official release of the Honor Magic V, except for a patent that was revealed in July 2021.
The official poster shows that the bezels of the Honor Magic V seem to be very thin, which is not common in foldable phones, but since this is just a promotional poster, we cannot confirm this yet.
In addition, if the smartphone is the same as the device shown in the patent, it will adopt a vertical folding solution. The patent mentions the bezels, hinges, and cables for the folding display.
According to sources, the Honor Magic V is expected to be released in January 2022 and will feature the Snapdragon 8 Gen 1 chipset. At the Snapdragon 8 Gen 1 chipset launch event, the Honor Terminal Co., Limited (Fang Fei) president stated that Honor’s next-generation flagship will also feature the chipset.
The Snapdragon 8 Gen 1 is based on Samsung’s 4nm manufacturing process. The chipset includes eight cores: a Cortex-X2 super core, three Cortex-A710 cores, and four Cortex-A510 cores. It also integrates the Adreno 730 GPU and the X65 5G modem.
Currently, the specifications and pricing of Magic V are unknown, but they will be revealed soon.
