Honor has announced that it will soon launch its first foldable phone. Surprisingly, before the official release of the Honor Magic V, there were no leaks or rumors, except for a patent revealed in July 2021.
The official poster shows that the bezels of the Honor Magic V seem to be very thin, which is not common in foldable phones, but since this is just a promotional poster, we cannot confirm it yet.
In addition, if the smartphone is the same as the device shown in the patent, it will adopt a vertical folding solution. The patent mentions the bezels, hinges, and cables for the foldable display.
According to sources, the Honor Magic V is expected to be released in January 2022 and will feature the Snapdragon 8 Gen 1 chipset. At the Snapdragon 8 Gen 1 chipset launch event, the president of Honor Terminal Co., Limited (Fang Fei) stated that Honor’s next-generation flagship will also feature the chipset.
The Snapdragon 8 Gen 1 is manufactured using Samsung’s 4nm process. The chipset includes eight cores: a Cortex-X2 super core, three Cortex-A710 cores, and four Cortex-A510 cores. It also integrates the Adreno 730 GPU and the X65 5G modem.
The specifications and price of the Magic V are currently unknown, but they will be revealed soon.