This morning, Xiaomi officially announced that the Xiaomi Civi 3 is coming soon and will be powered by the Dimensity 8200 Ultra chipset. The chipset could be an overclocked version of the Dimensity 8200. As officially stated, the chipset will be upgraded in terms of performance and imaging.
The Dimensity 8200 is based on a 4nm manufacturing process and has four Cortex-A78 cores (one core at 3.1 GHz and three cores at 3.0 GHz) and four Cortex-A55 cores at 2.0 GHz.
According to leaked information, the Xiaomi Civi 3 is expected to feature a punch-hole display with Full-HD+ resolution and a 120Hz refresh rate. It will have a 32MP lens (Samsung S5KGD2) for selfie shooting in the punch-hole.
On the back, the Civi 3 is expected to have a triple-camera module, with the primary camera expected to be a 50MP Sony IMX800 lens. According to the 3C certification, the phone will have a 4500mAh battery and support 67W fast charging.
The company still hasn’t revealed the launch date. However, the launch is expected to take place soon, and Xiaomi will also announce the launch date in the coming days.
