This morning, Xiaomi announced that the Xiaomi Civi 3 is coming soon and will be powered by the Dimensity 8200 Ultra chipset. The chipset could be an overclocked version of the Dimensity 8200. According to the official statement, the chipset will be upgraded in terms of performance and imaging.
The Dimensity 8200 is manufactured using a 4nm process and has one Cortex-A78 core clocked at 3.1 GHz, three Cortex-A78 cores clocked at 3.0 GHz, and four Cortex-A55 cores clocked at 2.0 GHz.
According to leaks, the Xiaomi Civi 3 is expected to feature a punch-hole display with Full-HD+ resolution and a 120Hz refresh rate. It will have a 32MP front lens (Samsung S5KGD2) for selfie shooting in the punch-hole.
The Civi 3 is expected to feature a triple rear camera module with a 50MP Sony IMX800 main lens. According to 3C certification, the phone will come with a 4500mAh battery and support 67W fast charging.
Xiaomi has not announced a release date yet. However, the launch event is expected to take place soon, and Xiaomi will reveal its key specifications in the coming days.