Xiaomi Civi 3 Officially Confirmed to Feature Dimensity 8200 Ultra Chipset

For a long time, it has been reported that Xiaomi is working on the next generation model of its Xiaomi Civi, which would be the fourth model of this lineup named “Xiaomi Civi 3.” Even a few weeks before, the model also got listed on a certification site. Until now, there was no official confirmation regarding the phone’s existence. However, today, the officials have also solved this issue.

This morning, Xiaomi officially announced that the all-new Xiaomi Civi 3 is coming soon and will be powered by Dimensity 8200 Ultra chipset. The chipset is probably the overclocked version of standard Dimensity 8200, released in December 2022. As said by the officials, the new chipset would be upgraded in terms of performance and imaging.

Xiaomi Civi 3 Chipset

In terms of specifications, the standard Dimensity 8200 is based on a 4nm manufacturing process and features the following cores: 4x Cortex-A78 Performance Cores (1 clocked @3.1GHz and 3 clocked @3.0GHz) and 4x Cortex-A55 Energy-Efficient Cores (clocked @2.0GHz).

According to previously leaked info, the all-new Xiaomi Civi 3 will feature a dual punch-hole display that supports Full-HD+ resolution and 120Hz refresh rate. Inside the dual punch-hole is a combo of 32MP lenses (Samsung S5KGD2) for selfie shooting.

On the backside, a triple camera setup is expected to be featured on Civi 3, in which the primary camera is expected to be a 50MP Sony IMX800 lens. The smartphone will be packed with a 4500mAh battery in addition to 67W fast charging support, as revealed through 3C certification.

The company still hasn’t revealed the launch date. However, the launch is expected to happen soon, and the officials will also announce the date in the coming days.


Harris Zahid

I'm a tech enthusiast, writer at, having a great Interest in Auto Industry And All Communications Related Equipment. Photography and Gaming are my Hobby too. For any query, contact me at

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