The Xiaomi 11 Ultra was launched on March 30. It has a Snapdragon 888 chipset, LPDDR5 memory, and UFS 3.1 storage, and features several new technologies, including a silicon oxide anode battery, a new phase-change thermal material, and a Samsung GN2 sensor.
This morning, Xiaomi’s official Weibo account released a teardown video of the Xiaomi 11 Ultra, allowing us to understand its internal structure and reveal the true features of its technologies.
After removing the back cover, you can see the 67W wireless flash charging module and the multi-functional NFC module. The upper part is the camera module, which includes a 50MP Samsung GN2 lens, a 48MP ultra-wide-angle lens, and a 48MP telephoto lens.
The Samsung GN2 sensor measures 1/1.12-inch, significantly larger than the other two lenses.
Remove the protective cover over the motherboard and battery. The motherboard integrates components such as the Qualcomm Snapdragon 888 chipset, LPDDR5 memory, and UFS 3.1 storage. The other side uses a new phase-change thermal material, which improves thermal conductivity by 100% compared to traditional cooling materials.
The top and bottom are designed with dual speakers: the top has a 1014 speaker, while the bottom features a 1216P 0.8mm amplitude speaker tuned by Harman Kardon and a linear motor.
Its battery capacity is 5000 mAh. It uses silicon-oxygen anode MTW technology, making the battery lighter and thinner. It also features a multi-pole fast-charging chip that supports 67W fast charging.
