On December 21, Honor has officially launched its full-screen smartphone – the Honor 9 Lite. The Honor 9 Lite features four cameras and boosts of excellent appearance. Now, let’s start the phone’s teardown to explore its internal layout and workmanship performance.
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The phone’s internal structure adopts three-stage design. The fingerprint wire on the back cover is connected to the motherboard on the phone body. The fingerprint wire is hidden under the metal cover.
After the comparison between the Honor 9 Lite and the Honor 9, we find that the Honor 9 has used more glue to fix its back cover than the Honor 9 Lite. Obviously, the Honor 9 has better sealing performance.
Now, look at the phone body. The smartphone adopts three-stage design structure. The frame parts have been thickened to resist violent collision. The surface of the battery hasn’t been covered by the ribbon cable. The wire ribbon is estimated to be designed on the battery’s bottom, which will make it more difficult to operate the following teardown process.
After removing the fixed cover, it is easy to dismantle the primary camera. We find that the 13MP primary camera on the right is covered by metal material to support autofocus, while the 2MP camera on the left is covered by nothing. But the two cameras are sealed together.
Remove the shield cover. We find three components on the motherboard including the processor, memory card, and flash memory card haven’t adopted multi-stack package process. The memory is from Hynix, and the flash memory is from Samsung. Undoubtedly this area covered by the cooling material is Kirin 659 processor.
In general, the Honor 9 Lite doesn’t have excellent internal layout or workmanship performance. The motherboard’s integration, chip protection, and connector fixation are satisfying.