First of all, Let’s take a look at this Huawei Honor 9 specification:
5.1 inch 1080 x 1920 pixels (428 ppi pixel density) LTPS IPS LCD capacitive touchscreen, 16M colors
HiSilicon Kirin 960 Octa-core processor (4×2.4 GHz Cortex-A73 & 4×1.8 GHz Cortex-A53) and Mali-G71 MP8 GPU
Dual 20MP + 12 MP, f/2.2, phase detection autofocus, 2x optical zoom, dual-LED (dual tone) flash
8MP, f/2.0 front camera
4GB RAM and 64GB ROM
EMUI 5.1 base on Android 7.0 Nougat
We don’t find the screws at the bottom, and the Huawei Honor 9 uses double-sided glass design, so the screen and the rear panel should be fixed to the fuselage with glues.
There are only speaker grille, 3.5mm headphone jack, and USB Type-C port at the bottom.
Let’s heat the back cover for about 2 minutes with a hair dryer.
Open the back cover a little bit with a suction cup. And then insert a pick under the back cover and slide the pick along the edge until opening it completely.
You can see the Huawei Honor 9 is still using the classic three-stage design, the upper is the motherboard, the middle is the battery, the lower is the USB-C board.
In order to achieve better heat dissipation, it uses a large piece of graphite thermal stickers to cover the fuselage.
After removing the screws, we tried to remove the loudspeaker, but it didn’t work. It looked very thin. I dare not use too much brute force, so I had to use the hair dryer to heat it up, and then remove the loudspeaker smoothly.
Honor 9 does not use the common adhesive tape to secure the battery, which it should use double-sided adhesive to fix the battery to the fuselage. If you replace the battery will be more trouble, after all, remove the battery is not so easy.
Skyworks 77643-21 RF Power Amplifier
RFMD RF5216A F709YX Quad-Band GSM, Linear EDGE Transmit Module
Hisilicon Hi6362 RF chip
Hisilicon Hi6421 power management chip
Hisilicon Hi6422 power management chip
Broadcom BCM47531A1 GPS, GLONASS, Beidou, QZSS receiver
The Huawei Honor 9 is doing quite well in terms of workmanship, and its metal frame makes the internal structure of the fuselage very strong. To achieve better heat dissipation, it uses a large piece of graphite thermal stickers to cover the fuselage, the metal shield of SOC/RAM chip is coated with thermal grease. And details such as rubber ring wrapped USB Type-C port and 3.5mm headphone port are doing quite well.
Each module can be replaced independently, it uses a lot of double-sided adhesive and glues, making replacement parts is not so easy.