On August 23, Meizu has officially launched the M6 Note in Beijing, China. The phone is powered by Qualcomm Snapdragon 625 mobile platform and come with a 12MP and 5MP dual camera setup on the rear. It available in three storage models: 3GB+16GB variant is priced at CNY 1,099 (approximately $164), 3GB+32GB variant is priced at CNY 1,299 (approximately $194), and 4GB+64GB variant is priced at CNY 1,699 (approximately $254). The phone does bring its fans much surprise. Let’s disassemble the Meizu M6 Note which is powered by Qualcomm Snapdragon 625 processor.
First of all, we need to switch off the phone. Then, take out the card slot and screws at the bottom for the further teardown later.
Turn off the power.
The Qualcomm Snapdragon 625 processor has been integrated into X9 LTE modem, which enables the M6 Note to support Cat.7.
After removing the screws at the bottom, we can open the smartphone’s back cover to see its internal structure.
The phone adopts three-stage design inside. We will disassemble it from the top to the bottom.
To begin with, we need to power off the device. Fasten the metal plate over the battery BTB and remove two fixed screws, and then we can start the teardown.
After removing all the BTB and RF plugs, we can take out the screws used to fasten the motherboard. Then the motherboard can be removed.
After removing the motherboard, there is an earphone unit on screen holder. Since the earphone unit is fixed by foam, we have to force it to be taken out.
Since the M6 Note is powered by Qualcomm Snapdragon 625 processor, the smartphone supports dual ISP (image signal processor) and up to 4K Ultra HD video capture @ 30FPS.
Then remove the battery. Pull out the glue, and then the 4,00mAh large battery can be taken out.
Then remove the vice-board at the bottom. The bottom is covered by loudspeaker box. After removing it, the vice-board can be seen.
Remove all the BTB and RF plugs on the motherboard, and then the vice-board can be taken out.
Vice-board detail picture
Take out carefully the Meizu’s symbolic mBack under the vice-board.
mBack fingerprint reader module