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Samsung 860 PRO SSD Teardown

In early 2014, Samsung introduced the first 3D flash, the 850 PRO/EVO, to the consumer market. About four years later, Samsung released the 860 PRO/EVO, an upgraded version of the 850 PRO/EVO. Today, we’re going to start teardown the Samsung 860 PRO 512GB SSD.
Samsung 512GB 860 PRO
The Samsung 860 PRO is about 2.5 inches large. We can see “Samsung” and “Solid State Drive” in the front of the SSD, without the product model number. The red square is below the words. The arrow mark on the right indicates the port direction.
Samsung 512GB 860 PRO front
More information can be found on the back of the SSD, including model number, capacity, production date, operating voltage, operating current, and so on. The 512GB 860 PRO that we will disassemble was made in November 2017.
back
As for the hardware port, the port on the left is the SATA 3.0, and its theoretic wideband is 6Gb/s. The power port is on the right. The SSD’s maximum sequential read speed reaches 560MB/s, and its maximum sequential write speed reaches 530MB/s. The SSD’s random read speed reaches up to100K IOPS and its random write speed up to 90K IOPS. The SSD with the SATA 3.0 interface doesn’t have as fast a speed as a SATA SSD.port
Remove the screws from the back. The SSD uses a pentagon screw, which is not common to see. After removing the back cover, we found that the PCB of the 860 PRO is quite small. The size of the PCB is just the 1/3 of the SSD.
remove the back cover
Generally speaking, the screws on the SSD can’t be separated from the back. However, the screw port on the back of the Samsung 860 PRO SSD is connected to the screw port on the side. The surfaces are all polished. The fixed method that the 860 PRO SSD applies to is better than the common fixed method that SSD uses. Of course, this fixed method has a higher demand on the front SSD’s hardness.
fixed method on the back
The front PCB is composed of a master control, a cache chip, a flash, and lots of capacitors.
front PCB
There is only a flash on the back of the PCB.
back of the PCB
The main control unit comes from Samsung’s own MJX controller. Specific information about the MJX controller (including core number, manufacturing process, etc.) is not known at this time. All we know is that the MJX controller supports LPDDR4 chips.
master control
The cache chip is 512MB LPDDR4.
512MB LPDDR4
The flash is from Samsung’s 3D MLC V-NAND, which is Samsung’s fourth-generation 3D NAND. The 3D MLC V-NAND’s capacity is 256GB, and its write life is 600TBW.
flash

Source
IT168

Kylie

I love all digital products, mobile phones, laptops, cameras, headsets, etc. Writing news about these products is also my specialty.

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