The Xiaomi Mi Max 2 comes with a 6.44-inch display with a resolution of 1080×1920 pixels. The phone is powered by 2GHz octa-core Qualcomm Snapdragon 625 processor, and it comes with 4GB of RAM. The phone packs 64GB/128GB of internal storage that can be expanded via a microSD card. It packs a 12-megapixel primary camera on the rear and a 5-megapixel front shooter for selfies.
Today we finally got a golden one, and then we cannot wait to open it to explore its internal structure.
First look at this Mi Max 2 specification:
6.44-inch (74.0% screen-to-body ratio), 1080 x 1920 pixels (342 ppi pixel density)
Qualcomm MSM8953 Snapdragon 625 Octa-core 2.0 GHz Cortex-A53
4GB RAM and 64GB ROM
12 MP rear camera with f/2.2 aperture, phase detection autofocus, dual-LED flash; 5 MP front camera with f/2.0 aperture
Android 7.1.1 Nougat
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We have also created some parts replacement tutorial for Xiaomi Mi Max 2. Please visit the Mi Max 2 repair guides category.
Insert a pick between the back cover and the fuselage, and then slowly slide the pick to release the snaps on the middle frame.
It is worth mentioning that Xiaomi Mi Max 2’s back cover is very easy to remove, before I am never so easy to remove a mobile phone back cover.
In the separation of the back cover and the fuselage should be noted that the fingerprint module cable on the back cover is still connected to the motherboard.
Disconnect the fingerprint module cable from the motherboard with a crowbar.
All the metal shields are welded to the motherboard, and one of the shields has a graphite sticker, according to experience the following should be the Snapdragon 625 processor and RAM. As most midrange machines, the integration is not particularly high, whether it’s motherboard or the bottom board.
The front camera module is really small, it comes from QTech, the model is F5E8YAR, but we did not find this product on Q-Tech’s official website.
On the main camera is marked with “A12N06P”, it should also come from QTech.
The touch chip comes from FocalTech with a model of FT5446DQS.
Most of the components are modular and can be replaced independently.
The battery can be replaced by pulling out the adhesive tape.
It is very easy to remove the back cover.
The internal structure of the motherboard, battery, bottom board three-stage design, most of the mobile phones are using such a design, very easy to develop and repair.
The middle frame is made of plastic material.