As we all know, Qualcomm’s upcoming flagship chipset is the Snapdragon 875G. There have been no leaks about this chipset yet, but today, we have some exciting news.
Today, a tech blogger revealed a market research report from an investment bank regarding MediaTek and Qualcomm. The report also mentions the Snapdragon 875G chipset, which will be manufactured using Samsung’s 5nm EUV process and is expected to be launched in the first quarter of 2021.
The report covers the Snapdragon 875G and some upcoming chipsets. The unknown SDM6853 chipset based on the 7nm EUV process will be launched in the third quarter of this year. According to previous reports, the SDM6853 is expected to be the Snapdragon 690. Then, in the fourth quarter, two chipsets will be launched: the Snapdragon 662 and the Snapdragon 460. The Snapdragon 662 has already appeared on Geekbench under the codename Bengal.
Next, we are looking at a new mid-range chipset based on the same process as the Snapdragon 875G, the Snapdragon 735G. This chipset is expected to be launched between the first and second quarters of 2021. In addition, there is a low-end processor, the Snapdragon 435G, which will be launched later than the Snapdragon 875G.
The reports also include the upcoming MediaTek chipsets, including the Dimensity 600 and Dimensity 400. The Dimensity 600 will be launched very soon, while the Dimensity 400 is expected to debut in the first quarter of 2021.
Earlier reports stated that the new SD875 chip and X60 5G modem have been sent to TSMC for mass production and are expected to be delivered in September. The new chipset will use a core combination of Cortex-X1 and Cortex-A78.