Vivo Xplay6 Teardown

Vivo Xplay6 was launched in November 2016. The phone comes with a 5.46-inch touchscreen display with a resolution of 2560 x 1440.

Vivo Xplay6 is powered by quad-core Qualcomm Snapdragon 820 processor and it comes with 6GB of RAM. The phone packs 128GB of internal storage cannot be expanded. As far as the cameras are concerned, the Vivo Xplay6 packs a 12-megapixel primary camera on the rear and a 16-megapixel front shooter for selfies.

Vivo Xplay6 runs Android 6.0 and is powered by a 4080mAh non removable battery. It measures 153.60 x 73.40 x 8.20 (height x width x thickness) and weighs 178.00 grams.

Vivo Xplay6 is a dual SIM (GSM and GSM) smartphone that accepts Micro-SIM and Micro-SIM. Connectivity options include Wi-Fi, GPS, Bluetooth, FM, 3G and 4G. Sensors on the phone include proximity sensor, accelerometer, ambient light sensor and gyroscope.

Before the beginning of dismantling the first step is removing the SIM slot to prevent damage to the fuselage in the disassemble process.

Remove two screws beside the Micro USB port.

The hyperbolic glass is pasted together with a white gasket and then secured with the metal back cover.

Insert a guitar pick between the back cover and fuselage, and then slide the pick along the edge of the fuselage.

After removing the back cover you can see the motherboard, battery and other internal parts, the motherboard was covered with a metal shield.

There is a large area of graphite thermal paste inside the back cover, but no injection NFC antenna, may still not NFC function.

The back cover and the middle frame are combined with a cover with a rubber strip, not only can make the body more closely, but also to prevent dust into the body.

The inner edge of the metal back cover has some antenna contacts.

The whole motherboard is almost all covered by a metal shield.

The interior design is the continuation of the more common three-stage design, but we found another mystery after dismantling, the design of the phone is more complex than any previous mobile phone.

The camera module is located in the center of the motherboard shield, and two cameras are mounted on a separate metal module, the flash is installed on the motherboard

The top of the motherboard has a number of metal contacts in contact with the metal contacts

SIM card slot is also covered by a large area of metal shield.

The bottom is the sub-board, fixed with plastic baffle. From left to right, respectively are the speaker, Micro-USB port, call microphone and 3.5mm headphone jack.

Remove the plastic baffle can be seen after the sub-board, the speaker is located on the baffle, through the contacts with the sub-board.

Sub-board is relatively simple, fewer chips, the front has two cable interfaces.

First remove the metal shield, the battery cable is under the metal shield.

Unscrew the screws to remove the metal shield. We can see most of the main chip on the motherboard are covered with metal shield, and part of the shield with copper foil to help heat dissipation.

There are some cables on the front of the motherboard. We will be removed one by one.

First disconnect the battery cable to ensure that there will be no circuit damage due to short circuit.

The battery is a lithium polymer battery with a capacity of 4000mAh and a nominal voltage of 3.85V.

The battery using double-sided adhesive fixed on the middle frame, first pull the label 1, and then pull the label 2, you can easily remove the battery down.

Disconnect all cables from the bottom board.

The back of the motherboard has a large metal shield, and covered with copper foil.

TI BQ24192, it is a battery charger IC.

Disconnect all cables from the motherboard and remove all screws securing the motherboard.

Remove the motherboard, the metal shield is covered with a large area of copper foil, and through the thermal grease connected with the middle frame, this design will be better heat conduction to the middle frame to help heat dissipation. In the use of metal shield can be described as spare no effort, the back of the motherboard completely without any exposed chips.

The front of the Xplay6 motherboard also has two large copper foil.

Xplay 6’s with a 12MP and 5MP rear camera, the 12MP camera use the Sony IMX362 sensor, with a 4-axis OIS optical image stabilization, the lens aperture f / 1.7. Two cameras with glue attached to the metal frame, quite strong.

Front camera was 16 million, equipped with a soft self-timer, soft light is fixed on the motherboard.

After ripped copper foil on the back of the motherboard, you can see the SoC chip with a lot of thermal grease.

Remove all metal shields from the motherboard.

Samsung’s K3RG6G6 0MMMGCJ LPDDR4 memory chip is located on the back of the motherboard. The capacity of 6GB, the following package Qualcomm MSM8996 Sanpdragon 820, the use of 14nm FinFET process, equipped with Adreno 530 graphics processor.

Qualcomm PM8996 power management IC

Samsung KLUDG8J1CB-B0B1 flash memory chip

ES9038Q2M Audio chip

Like the previous generation, the Xplay6 also uses three op amps, but upgrade to the OPA1622, which is a Burr-BrownAudio amplifier from Texas Instruments, is widely used OPA1612 Upgraded version. Xplay6 audio circuit is rather special, three op-chip arrangement in the sub-board, through the cable connected ot the motherboard, intuitively seems to affect the sound quality?

Qualcomm WTR3925 LTE transceiver

Skyworks 77824-11 LTE power amplifier module

NXP TFA9890A, an audio chip that primarily serves Smart PA audio solutions with class-D amplifiers. Smart PA can greatly enhance the output power and improve the sound quality.

Qualcomm QCA6174A wifi and Bluetooth integration module

Qualcomm PMI8996 Power Management IC

Qualcomm WCD9335 audio decoder chip

RFMD RF7460 multi-mode multi-frequency PA module

Leave a Reply

Your email address will not be published. Required fields are marked *


+ one = 3