Today, Honor announced that it will hold a global press conference on August 12, officially releasing Honor Magic 3, the most powerful flagship mobile phone in the history of Honor.
Subsequently, a digital blogger exposed the spy photos of the engineering machine of Honor Magic 3. Although the phone was wrapped in a thick confidential case, it still revealed some important information.
It can be clearly seen in the figure that the Honor Magic 3 will use a curved screen, which may be basically the same as the 80° super-curved screen of the Honor V40 series.
It is not difficult to find through the icon distribution on the top status bar that the phone will also adopt a dual punch-hole design, and it should be accompanied by an ultra-wide lens to achieve better selfie effects.
It is worth mentioning that the picture also leaked the configuration of the phone. The processor is SM8350, which is also the code name of the Snapdragon 888 series. Combined with the official publicity, the phone should be equipped with the latest Snapdragon 888 Plus processor. This is also the world’s first phone with Snapdragon 888 Plus.
At the same time, the Honor Magic 3 has a 12GB ultra-large memory to ensure the performance output of multiple applications and games at the same time, which can be more smooth in daily use.
According to the Digital Chat Station, Magic 3’s code name is Elizabeth. It will use a 6.76-inch curved OLED screen with a resolution of 2772×1344p. There are dual punch holes in the upper left corner.
In addition, according to the 3C certification, this phone is equipped with a 66W wired charger, and the high-end version comes with 100W wired fast charging and 50W wireless fast charging.
