Huawei Honor V8 Teardown

The Honor V8 features an octa-core Kirin 950 SoC (four Cortex-A72 cores at 2.5GHz and four Cortex-A53 cores at 1.8GHz), paired with a Mali T880 GPU and 4GB of RAM. The phone offers 32GB or 64GB of internal storage and supports expansion via microSD card (up to 128GB). Its hybrid dual SIM slot design can accommodate either two Nano-SIM cards or one Nano-SIM card and one microSD card.

The Huawei Honor V8 is priced as follows: the 4GB RAM with 32GB internal storage variant is priced at CNY 2,299, the 4GB RAM with 32GB internal storage variant is priced at CNY 2,499, and the 4GB RAM with 64GB internal storage with QHD display variant is priced at CNY 2,799.

Before the teardown process, we need to remove the SIM card tray.

Heat the cover on the top of the phone with a heat gun.
Then, insert a plastic pick under the cover. Slide the pick to remove it from the phone.

Remove the cover.

Remove the three screws that secure the cover to the phone.

Lift the display assembly a little bit with a suction cup.

Be careful. The fingerprint recognition module is still connected to the motherboard.

The yellow cable is a cable for the fingerprint recognition module.

Close-up of the bottom board.

The back cover has two waterproof foam blocks, which are used to fix various small modules.

Remove the four screws securing the metal bracket.

Remove the two metal brackets.

Under the metal bracket, you can access the button cable, LCD/Touch cable, battery connector, fingerprint recognition module cable, and bottom board cable.

Remove all screws securing the motherboard. You can remove the motherboard.

With the motherboard removed, you can access the earpiece, 3.5mm headphone jack, and antenna (connected to the bottom board).

Remove the speaker module.

The Type-C port and microphone are integrated into the bottom board.

Main antenna contactor and speaker contactor.

Close-up of the vibrator module.

The Huawei Honor V8 comes with a 3400mAh, 12.99Wh Li-polymer battery.

Front camera: 8MP, F2.4 aperture.
Dual rear camera (color, black and white): 12MP, pixel area 1.25μm, F2.2 aperture.

1. FCI FC7712A CDMA3G / 2G RF
2. SKY77765-1 CDMA / WCDMA / HSDPA / HSUPA / HSPA + / LTE RF
3. SKY13535 SP12T + SP9T carrier aggregation switch
4. Quorvo TQF6297H RF amplifier
5. Hi6362 RF
6. Hi6421 power management IC
7. Hi6422 RF

1. Micron 4GB LPDDR4 + Kirin 950 POP
2. Toshiba 64GB eMMC 5.1
3. ALTEK 6610 ISP
4. NXP66T16 NFC
5. MAX98925 audio amplifier
6. VIA CPM1.0A RF
7. Texas Instruments BQ25892 fast charge IC
8. VIA CBP8.2D CDMA baseband
9. SKY77597-11 RF
10. Hi6362 RF