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Redmi K30S Spotted on TENAA: All Specs Leaked

This morning, the new expected device from Redmi, “Redmi K30S,” has been spotted on the TENAA certification site. The Certification has revealed all the specs of Redmi K30S. This device has a model number “M2007J3SC,” which is already spotted on many certification sites.

 

The Certification mentioned that the new Redmi K30s would feature a Single Punch-Hole 6.67 Inches Full-HD+ (2400x1080p) LTPS IPS display. The display has 16.7M color depth and may also support a 144Hz refresh rate (as per rumors). The phone has total dimensions of about 165.1×76.4×9.33 (mm) and weighs around 216g.

Inside the phone, it would be powered by the standard Snapdragon 865 (7nm) chipset, which is an octa-core chipset with a maximum frequency of 2.84 GHz. The chipset name is confirmed from the previous Geekbench of this model.

Moreover, it would be available in three RAM variants and three storages: 6GB, 8GB, and 12GB with 128GB, 256GB, and 512GB. The phone got a quad-camera setup with a main 64MP primary sensor, while the front camera uses a 20MP sensor.  The camera bump is a lot similar to Mi 10T Pro’s camera bump. This model is also equipped with a side fingerprint scanner.

It is also mentioned that the phone would feature a 4900mAh battery with fast charging support (charging speed not mentioned). The phone will also support Dual-SIM 5G Network. After Redmi K30 Ultra with Dimensity 1000+, Xiaomi is now planning to extend Redmi’s K30 series with this new model, “Redmi K30S”.

This device may not be limited to China as this device will feature Qualcomm’s Snapdragon 865, while the devices with Dimensity chipsets are currently limited to China.

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Harris Zahid

I'm a tech enthusiast, writer at MyFixGuide.com, having a great Interest in Auto Industry And All Communications Related Equipment. Photography and Gaming are my Hobby too. For any query, contact me at h.zahid@myfixguide.com.

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