It is known that Honor is very near to launch its Honor 50 Series. It is worth mentioning that this would be the first time Honor is releasing its main series flagship phone after getting separated from Huawei. Today, some new developments have been revealed regarding the upcoming series.
The Weibo blogger (@PengPengJunArrives) has recently revealed that the backside renders of Honor’s upcoming flagship phone, Honor 50. It can be seen that the shape of the camera module is a lot like Huawei’s Nova8 camera bump.
The camera module consists of two circles in which the first one contains a single primary camera sensor, while the second circle consists of two lenses. As per the blogger, this camera module design will be named “Cartier Ring Design.” The blogger further mentioned that the color would be named “Jifeng Blue.”
Moreover, the famous Chinese blogger @DigitalChatStation has also revealed that the new Honor 50 series will be released in June. It is tentatively scheduled to debut in the first half of the year.
Previously, it was reported that the all-new Honor 50 series is expected to feature Qualcomm’s chipsets. The base model is expected to feature Snapdragon 870 sub-flagship chipset, while the high-end version will use Snapdragon 888 chipset, the most powerful chipset from Qualcomm.
The complete specifications list of the high-end version (Honor 50 Pro+) is already live on our site, while the specifications of other versions are currently unknown.For more exclusive mobile phone tips, follow up our Twitter page