The Honor Magic 2 has a unique mechanical structure. This smartphone boasts abundant and complex hardware features, such as a slide-out screen and six cameras. Now, we will disassemble this phone to explore its internal structure.
First, power off the phone and remove the SIM card tray. Heat the back cover with a suction cup and then separate it from the phone body with a pick. Before removing the back cover, slide it to unlock the screen first. After opening the back cover, its internal structure can be seen. A lot of graphic stickers have been applied to the back of the back cover. In this way, the phone can achieve better heat dissipation.
Then, remove the back cover. The back cover has four openings for the triple rear camera setup. Both the motherboard and the battery are covered by metal plates. This smartphone has a compact and tidy internal layout. After removing the screws, use tweezers to remove the cover from the motherboard. By the way, the Magic 2 uses two different sizes of screws.
Next, slowly remove the battery to avoid damaging it. According to Huawei’s official information, the Honor Magic 2 features a 3500mAh battery and supports 40W fast charging. This phone can charge to 50% in 15 minutes and to 80% in 30 minutes. Other phone batteries come with one cable, while the Magic 2 has two. Now, the motherboard and camera module need to be removed. Disconnect the camera cable and remove the camera module.
The camera module consists of a 24MP black-and-white camera and a 16MP camera. The component on the right is a 16MP ultra-wide-angle camera. This rear camera features a 117-degree field of view and an F/2.2 aperture. The next step is to remove the three front cameras. Its front triple-camera module consists of two 2MP infrared cameras and one 16MP main camera.
The infrared camera is located at the position marked by the red circle, while the main camera is located at the position marked by the blue circle. The front of the phone has three cameras: a 16-megapixel main camera in the center, and two 2-megapixel infrared cameras on either side. After removing the motherboard, we found that the main chips were all coated with thermal paste.
The HiSilicon Hi6421 power management chip is located on the front of the motherboard. On the back of the motherboard, there are multiple chips. The component circled in red is the SK Hynix H9HKNNNFBMBU LPDDR4X memory chip, the one circled in blue is the HiSilicon Hi1103 Wi-Fi chip, and the component circled in yellow is the Toshiba THGAF8T0T43BAIR 128GB flash memory. We speculate that the Kirin 980 chip is located under the LPDDR4X memory.
After removing the motherboard, the aluminum alloy frame in the middle is visible. By removing the screws and taking out the frame, the five-track sliding structure can be seen. We have marked the five tracks in the image.
This is the upper area of the screen backplane. The video shows the working principle of the five-track sliding structure. Now remove the sub-board. The speaker is located in the lower right corner. On the right of the speaker is the vibration motor.
Due to a lack of tools, we have not yet removed the screen. If the screen were removed, the sliding mechanism and the optical fingerprint sensor beneath it would be visible. Even so, the Honor Magic 2 demonstrates flagship-level capabilities through its reasonable internal layout and high-performance components.
