Today, Honor announced that it will hold a launch event on August 12 to release the Honor Magic 3 series.
Subsequently, a tech blogger revealed spy photos of the Honor Magic 3 engineering prototype. Although the phone was encased in a thick protective case, it still revealed some important information.
The photo clearly shows that the Honor Magic 3 will feature a curved screen, which may be similar to the 80° super-curved screen of the Honor V40 series.
Based on the distribution of icons on the top status bar, this phone also features a dual punch-hole design and should come with an ultra-wide lens to enhance selfie performance.
It is worth mentioning that this image also reveals the phone’s specifications. It comes with an SM8350 chipset, which is the codename for the Snapdragon 888 series. Combined with official promotional materials, the phone is expected to feature the Snapdragon 888 Plus chipset.
At the same time, the Honor Magic 3 has 12GB of memory, ensuring smooth multitasking and gaming performance for a more seamless everyday experience.
According to Digital Chat Station, the codename for the Magic 3 is Elizabeth. The device will feature a 6.76-inch curved OLED screen with a resolution of 2772 x 1344. There are two punch holes in the top left corner.
In addition, according to the 3C certification, this phone comes with a 66W wired charger, and the high-end version supports 100W wired fast charging and 50W wireless fast charging.