Realme GT Neo3 Will Feature Dimensity 8100 Chipset, Independent GPU, UFS 3.1, and LPDDR5 Combo

Yesterday, it was reported from Realme’s officials that the all-new Realme GT Neo3 would come with the industry’s second-fastest charging system, i.e., 150W charging in addition to a 4500mAh battery (50% charge in 5 minutes). Today, the company has released another highlight of the upcoming smartphone.

This morning, Realme’s VP (Xu Qi) has revealed that the all-new Realme GT Neo3 will feature the Dimensity 8100 sub-flagship chipset and Independent GPU (Graphics chip). Both of them have lower power consumption and more powerful performance. In addition, the gaming experience is also going to be excellent.

Realme GT Neo3 Features

Realme GT Neo3 Chip

It is worth mentioning that Dimensity 8100 chipset is based on a 5nm TSMC process and has a higher frequency when compared to the standard Dimensity 8000. The chipset consists of eight cores in which there are four Cortex-A78 cores (@2.85GHz) and four Cortex-A55 cores (clocked @2.0GHz). The GPU is still Mali-G610.

Moreover, the device also comes with the upgraded combo of LPDDR5 Memory and UFS 3.1 Storage which is currently the best in the industry.

As reported earlier, the new Realme GT Neo3 will feature a larger 6.7 inches AMOLED Display having a single punch-hole (in center-top) and supports Full-HD+ resolution with a high refresh rate. There might be two battery versions: 4500mAh battery with 150W charging and 5000mAh battery with 80W charging.

In terms of imaging, the smartphone would feature a triple 50MP+8MP+2MP camera setup in which the 50MP lens is the Sony IMX766 with OIS. On the front, there would be a single 16MP lens.

The all-new Realme GT Neo3 will be launched on March 22 at 2 PM (Chinese Timing).


Harris Zahid

I'm a tech enthusiast, writer at, having a great Interest in Auto Industry And All Communications Related Equipment. Photography and Gaming are my Hobby too. For any query, contact me at

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