Xiaomi Mi 9 Teardown

Today, Wang Teng, Product Director of Xiaomi Company, showed some internal photos of the Xiaomi Mi 9. Let us take a look at the internal structure of the device from these photos.

After removing the back cover, the wireless charging coil and NFC module become visible. This large wireless charging coil also occupies a significant amount of space inside the device.

Next, remove the wireless charging coil, and we can access the battery. According to the information on the battery, we know that the battery is manufactured by Sunwoda.

This is the wireless charging coil and NFC module. This phone supports 20W wireless charging.

In this picture, the battery, mainboard, and sub-board have all been removed. Thermal paste is applied beneath the mainboard. At the lower part of the device, there is a fingerprint module and a vibrator.

The back of the Xiaomi 9 motherboard houses some RF and power chips. Wang Teng stated that these chips have been treated with P2i waterproofing. Public information indicates that P2i technology involves coating the product surface with a layer of nano-polymer film, so even if liquid enters the device, it will not affect the internal components.

The front of the motherboard features the Snapdragon 855 processor, memory module, and a SIM card slot.

This is the rear camera module, which contains three cameras. As you can see, the 48MP IMX586 sensor is quite large. Its pixel size is 0.8 μm, the field of view is 79°, and the aperture is F/1.75.

This is the speaker with a number of 1217, and you can see that it is quite large in size.