Today, Wang Teng, product director of Xiaomi Company, showed some internal pictures of Xiaomi Mi 9. Let us take a look at the internal structure of the fuselage from this set of pictures.
In this step, the middle frame has been removed. The upper part has some thermal grease, the fingerprint identification module can be seen in the lower part, and the right side has a large size Z-axis motor.
This is the back of the motherboard of Xiaomi Mi 9, mainly distributed with some RF and power chips. Wang Teng said that this part of the chips has done P2i waterproof treatment. The publicly available data shows that P2i is coated with a layer of nano-polymer. This film is attached to the surface of the product. Even if liquid enters the device, it will not affect the components.
This is the rear camera module, which contains three cameras, and you can see that the 48-megapixel IMX586 is quite large. Its pixel size is 0.8um, FOV 79°, F/1.75, 6P lens, support 4-in-1 to achieve 1200MP+1.6um large pixels.