This afternoon, Digital Chat Station revealed the specifications of the Dimensity 7000 5G chipset. According to the blogger, these are the specifications of an engineering prototype, and the actual chipset specifications may differ.
The Dimensity 7000 5G will be manufactured using TSMC’s 5nm process and features an octa-core architecture, including four Cortex-A78 cores clocked at 2.75 GHz and four Cortex-A55 cores clocked at 2.0 GHz. It also comes with a Mali-G510 MC6 GPU.
The Dimensity 7000 5G seems to be a mild upgrade of the Dimensity 1100, as both have the same core architecture and number of cores. The only difference is the Cortex-A78 core frequency (2.6 GHz on the Dimensity 1100).
This chipset has several improvements compared to the Dimensity 1100, including an upgraded Mali-G510 GPU and a more advanced manufacturing process. This chipset will replace the Dimensity 1100 on the market.
In 2022, many mid-range smartphones are likely to feature this chipset. To enhance competitiveness, Qualcomm will also need to launch an upgraded version of the Snapdragon 870 5G.