As we all know, Meizu held an event to launch the Meizu 15 and the Meizu 15 Plus on April 22. Both phones feature a circular design with ultra-narrow bezels. The Meizu 15 Plus features a 5.95-inch Samsung OLED screen, and it is powered by an Exynos 8895 processor. Today, we will start the teardown of the Meizu 15 Plus to explore its internal structure and workmanship.
First, remove the SIM card tray and power off the phone.
Then, remove the two screws at the bottom of the phone.
It is more difficult to tear down this phone than the Meizu Pro 7. I spent a long time separating the back cover from the phone body.
After removing the back cover from the phone body, we can access the motherboard, battery, and other components. The phone has a neat internal layout design, and its back cover is made of stainless steel and aluminum alloy.
The switch and volume keys are connected via the metal contacts on both sides. Removing the button can effectively save time for after-service maintenance. This design shows that the phone has adopted a reasonable layout design for its internal structure.
After removing the six screws, we found that the motherboard and the top of the battery were covered with black tape. This is to prevent the cables from loosening during phone use, as the display cable and battery cable are located under the tape.
Peeling off the black tape reveals certain areas of the motherboard. The chip area is covered by metal shields, and the dual vertical cameras in the center are clearly visible.
Remove the front camera.
The Meizu M15 series also features a unique design for the headphones, providing users with a better audio experience.
We can see a vertical dual camera setup and ring flash. There are seven screws on the motherboard in total, and three screws around the camera are made of stainless steel.
The phone features a 12MP wide-angle lens and a 20MP telephoto lens vertical dual camera setup, which uses Sony’s IMX 380 and IMX 350 sensors. The main camera supports OIS and EIS functions and adopts PDAF technology.
Unlike the Pro 7, the Meizu 15 Plus does not feature an L-shaped battery. This is the front of the motherboard.
It is the back of the motherboard. These are the main chips.
There are eight screws in total at the bottom. After removing the screws, we can remove the loudspeaker.
Disconnect the cable from the sub-board.
The Meizu 15 series features the mEngine system, delivering a more authentic touch experience.
It is the motherboard cable. We can see that its cable has a reasonable layout.
The phone comes with a 3500mAh battery, which enables the phone to work for a long time.
There are two transparent tapes on the left and right of the battery. Remove the tapes, and then you can remove the battery.
With the battery removed, we can see the screen cable hidden under the battery.
The phone has the thinnest fingerprint module, with a thickness of 0.25mm. Users can unlock the phone in under 0.08 seconds by pressing the mBack and mTouch buttons.
Summary
After taking apart the Meizu 15 Plus, we find that it has excellent workmanship and a reasonable internal design. The new Flyme 7 system will deliver more powerful performance. Meizu is always committed to attracting consumers through unique design, superb craftsmanship, excellent quality, and continuous innovation to create a better user experience.