This morning, Redmi announced that the Redmi K70 series will be launched on November 29. The launch poster shows that the series will feature flat edges, and the camera module is similar to Apple’s latest iPhone.
Redmi stated that this series embodies the brand’s achievements over the past ten years. In addition, consumers will witness revolutionary breakthroughs in performance and artificial intelligence in this series.
According to previous reports, the K70 series will include three devices: the K70E, K70, and K70 Pro. The K70E will be powered by the Dimensity 8300 chipset. The chipset is manufactured using a 4nm process and has four Cortex-A715 cores and four Cortex-A510 cores.
It is currently unclear which chipset the K70 will use. The K70 Pro has been confirmed to feature the Snapdragon 8 Gen 3 chipset, which is currently Qualcomm’s best chipset. The chipset is manufactured using TSMC’s latest 4nm process and has one Cortex-X4 core, five Cortex-A720 cores, and two Cortex-A520 cores.
In the coming days, Redmi is expected to tease key highlights of the K70 series ahead of the launch event.