This morning, Redmi revealed that the Redmi K70 series will be launched on November 29. The release poster shows that the Redmi K70 series will have a flat-frame design, and the camera bump also appears to be large, similar to the one on Apple’s latest iPhone.
Redmi mentioned that this lineup is the result of 10 years of Redmi’s progress. In addition, consumers will also be able to witness a revolution in performance and artificial intelligence in the series.
According to previous reports, the Redmi K70 series will include three devices: the K70E, K70, and K70 Pro. The Redmi K70E will be powered by the Dimensity 8300 chipset, which is a mid-range chipset.
The chipset is based on a 4nm manufacturing process and has four Cortex-A715 cores and four Cortex-A510 cores.
It is not yet known which chipset the Redmi K70 will use. The Redmi K70 Pro is confirmed to be powered by the Snapdragon 8 Gen 3 chipset, which is currently the best chipset from Qualcomm.
The chipset is based on TSMC’s latest 4nm manufacturing process and has one Cortex-X4 core, five Cortex-A720 cores, and two Cortex-A520 cores.
In the coming days, Redmi is expected to tease many highlights of the K70 series ahead of the launch event.
