ZTE Axon M Teardown

As we all know, ZTE has officially launched the ZTE AXON M. The smartphone features two 5.2-inch 1080p displays. The phone was very popular in the market due to its unique appearance. Now, we will take apart the ZTE AXON M to explore its internal structure.

First, remove the SIM card tray. The SIM card tray supports dual SIM cards.

Remove the screws hidden under the plastic sheet.

Use the hexagonal screwdriver to remove the screws.

After removing all screws, the back cover still cannot be separated from the phone body. Therefore, we need to use a pick to separate the back cover.

Then, slide the pick to unlock the clips on the back cover.

After removing the back cover, you can see the internal structure of the phone.

Its internal structure adopts a three-stage design. Some connectors are secured with metal plates, while the rest are secured with foam.

The back cover is covered with a graphite sticker.

The four corners of the smartphone have been reinforced to enhance hardness and protect internal components.

Remove the two screws securing the metal plate.

After removing the metal plate, we found that there is a layer of foam on the back of the metal plate to ensure the stability of the connector.

Disconnect the three connectors under the metal plate, including the main display connector, the power connector, and the sub-board connector.

Then, use the insulated pry tool to disconnect the connector of the button on the side and the connector of the fingerprint module.

The main camera is covered with a heat-dissipating copper plate, which can improve its stability during normal operation.

The phone features a 20MP main camera with an F/1.8 aperture that supports PDAF technology. After testing, we found that the main camera performs excellently in terms of blur effects.

Disconnect the connector of the secondary display. The connector uses a unique flexible material to ensure signal transformation even under frequent folding operations.

Then, we can separate the main board from the phone body.

The important chips on the front of the motherboard are protected by metal shields.

The back of the motherboard evidently has better space utilization than the front. Most chips on the back of the motherboard are covered by metal shields.