Xiaomi Mi 5 Teardown

February 24, Xiaomi held a press conference in the national convention center in Beijing, officially released a new flagship – Xiaomi Mi 5.

Xiaomi Mi 5 uses 5.15 inches 1080p display, equipped Qualcomm Snapdragon 820 processor, built-in 3 / 4GB of memory and 32/64 / 128GB storage, it is provide a 4-megapixel front camera and a 16-megapixel rear camera, battery capacity of 3000mAh, support for dual card dual standby entire network (with or slot).

The 3GB 32GB version is priced at 1999 yuan, 3GB 64GB version is priced at 2299 yuan, 4GB 128GB version is 2699 yuan.

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Tools needed: Screw driver, tweezers, crowbar, suction cup, guitar pick

Remove the SIM card tray with an E-ject pin.

Card tray design: dual Nano-SIM card

Xiaomi Mi 5 back cover made of glass material. It is fixed to the phone body by buckle.
Hike the back cover a little bit with a suction cup. Insert your fingers and the back cover to remove it.

There is a layer of graphite thermal film on the back cover.

Remove nine screws securing the antenna bracket.

The screw is covering by xiaomi’s fragile sticker,

Remove the antenna bracket.

GPS antenna (top) & Wi-Fi / BT antennas (right)

Disconnect the battery connector from the motherboard.

Disconnect the sub-board cable, LCD cable, side button cable and distance sensor cable.

Disconnect the RF antenna.

Remove the screw that securing the motherboard.

Lift up and remove the motherboard.

Remove the front camera.

Here’s front camera module.
4MP, f / 2.0 aperture, 80 degrees wide-angle

Disconnect the rear camera from the motherboard.

Here’s rear camera module.
16MP, f / 2.0 aperture, support axis optical image stabilization, phase focusing

SOC: Qualcomm Snapdragon 820(MSM8996), 14nm FinFET, 64-bit Kryo 4 Core

GPU: Adreno 530 GPU 624MHz

RAM: SEC Samsung 543 K3RG4G4 OMMMGCJ, 3GB LPDDR4 1866 MHz two-channel

POWER Management IC: Qualcomm PMI8994

POWER Management IC: Qualcomm PM8996

SPEAKER DRIVER IC: NXP TFA9890A

NFC: NXP 66T17

AUDIO DECODER IC: Qualcomm WCD9335

POWER AMPLIFIER MODULE: SKYWORKS, 77646-51, Multimode Multiband Power Amplifier Module for Quad-Band GSM/EDGE – Bands1, 25, 3, 4, 26, 8, 13, 12, 20, 28, 34, and39,WCDMA/HSDPA/HSUPA/HSPA/LTE

ROM: TOSHIBA THGLF2G9J8LBATR, UFS 2.0, 64GB

Quick Charge IC: Qualcomm SMB1351, Quick Charge 3.0

Wi-Fi/BT IC: Qualcomm QCA6164A

RF TRANSCEIVERS: Qualcomm WTR3925, support 2G、3G and 4G/LTE, integrated GPS, GLONASS and Beidou satellite navigation system.

Remove seven screws securing the speaker module.

Remove the speaker module from the phone body.

Remove the battery from the phone.

Charging voltage: 4.40V 2910 / 3000mAh
Rated capacity: 2910 mAh 11.2 / 11.6Wh

Xiaomi Mi 5’s charger
Input: 100 – 240VAC, 50/60Hz, 05A
Output: 5V 2.5A/9V 2A/12V 1.5A

Remove two screws securing the sub-board.

Disconnect the vibrator from the board.

Disconnect the fingerprint home key.

Disconnect the RF antenna.

The sub-board cable is fixed on the body by double-sided adhesive.

The vibrator, main MIC, Type-C port, FR connect seat and fingerprint home key are integrated on the sub-board.

Remove the vibrator with a crowbar.

Vibration motor, the model is 0825, using the ZIF connector.

Remove the light distance sensor with a tweezers.

Here’s light distance sensor.

Remove the telephone receiver with a tweezers. It is fixed by foam rubber.

Telephone receiver

Remove the side button.

Disconnect the TP BTB.

TP IC is come from Synaptics.

Heat up the front of the screen with a hot gun for about 5 minutes.

Here’s display assembly.

Touch buttons & button light

Remove the fingerprint recognition module with a tweezers.

The width of the fingerprint recognition module is only 4.68mm.

Comments(3)
  1. nazrul islam March 23, 2017
  2. Zarb March 23, 2017
  3. Ali G June 3, 2017

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