Honor X10 Internal Structure Diagram Leaked: Much Improved Heat Dissipation Technology

The Honor X10 launch is already confirmed on May 22, following the official announcement by Zhao Ming. Recently a blogger on Weibo also exposed the internal structure of Honor X10 which shows us about the heat dissipation system on the upcoming phone.

Honor X10 Internal Structure

According to the blogger, the new upcoming Honor X10 uses the large-area graphene heat dissipation technology which is already used in the last Huawei Mate series (Mate30). From this, we can say that the heat dissipation performance of the Honor X10 will be much improved. It will also let you do heavy gaming without any overheating of the phone.

It is previously reported (in our article) that the Honor X10 is expected to use a front pop-up camera with a rear matrix camera. According to information from our previous article (about Honor X10), the Honor X10 is 8.8mm thick and weighs only 203g.

Talk about the specifications of Honor X10; It has a 6.63 inch IPS LCD display with a resolution of 2400x1080p (FHD+). It is equipped with an all-new Kirin 820 chipset, which also supports 5G connectivity and already beaten the Snapdragon 855 and Kirin 980 in performance. The battery capacity of the phone is about 4200 mAh and supports 22.5W fast charging. This time we got the side fingerprint scanner, which is in the lock screen button. From the configuration point of view, the Honor X10 is a national 5G mobile phone, which helps in promoting the popularization of 5G.

The storage variants and pricing of this phone is still not confirmed. The Honor X10 is set to be launched on May 20.


David Tian

David is the editor @ MyFixGuide. He loves technology, especially good at laptops and mobile phones. In his free time, he loves to take apart the latest mobile phones and laptops.

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