Xiaomi Mi MIX 2 teardown

As one of the best-selling smartphones in the market, the Xiaomi Mi MIX 2 has made many improvements on its internal design and material. The teardown of the Xiaomi Mi MIX 2 is not difficult. Now, let’s start the teardown on the Xiaomi Mi MIX 2.

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Xiaomi Mi MIX 2 SIM card tray
The phone’s SIM card tray design is in a quiet tight layout, and no particles can be found in the SIM card tray.

removing Xiaomi Mi MIX 2 back cover
Utilize the pick and suction cup to easily expand the seam between back case and body.

sealant
The newly added sealant doesn’t have good viscosity.

open Xiaomi Mi MIX 2 back case
Then open the back case. But the back case can’t be completely separated from the phone because the ribbon wire of fingerprint reader is still connected with motherboard.

removing Xiaomi Mi MIX 2 main cover
The main cover has been successfully removed. The main cover adopts metal injection molding process, and gold printed antenna has been designed into the plastic layer.

Xiaomi Mi MIX 2 antenna design
The antenna’s number has been increased owing to the enhancement of communication capability. The Xiaomi Mi MIX’s surface is covered with NFC antenna, while the Xiaomi Mi MIX 2’s NFC antenna has been removed to the back case. The LED flash the Xiaomi Mi MIX adopts on the back has been designed on the Mi MIX 2’s main cover. In this way, LED flash’s failure resolute from poor contact can be avoided.

Xiaomi Mi MIX 2 connection method to motherboard
The Xiaomi Mi MIX 2’s connection method to motherboard is different from its predecessor’s because of vibrate earphone. It connects to the motherboard via bridge circuit on the main cover. The metal material the MIX 2’s main cover adopts is thinner than the plastic material MIX features. With such design, the MIX 2 can bring better electrostatic shielding.

Xiaomi Mi MIX 2 motherboard connector layout
Compared with its last generation, the Xiaomi Mi MIX 2 has made some adjustments on motherboard connector’s layout. The main changes include that the MIX 2 has replaced piezoelectric ceramics components with vibrate earphone and liner vibrator has superseded rotor vibrator. Compared with rotor vibrator, the linear vibrator acts with swifter response and creates lower noise. The Mi MIX 2 has cancelled earphone port, which can improve sealing effect.

Xiaomi Mi MIX 2 internal design without back case
After remove the back case, the MIX 2’s internal design can be clearly seen. It is obvious that the phone continues the MIX’s design and adopts three-stage layout. It has new design on loudspeaker structure. Its battery doesn’t occupy much space since its motherboard has occupied much.

Xiaomi Mi MIX 2 back design
The MIX 2 has continued the MIX’s design on the back. But it adds double sided tap around the phone not only to avoid the MIX’s loose problem but improve sealing effect. Personally speaking, it will have great improvements both on ergonomics and appearance if the phone’s back adopts curved surface design like the Note series.

power off Xiaomi Mi MIX 2's system
The analysis on the back case is over. Power the system off first before continue the teardown.

removing Xiaomi Mi MIX 2' motherboard
Then remove the motherboard.

Xiaomi Mi MIX 2's motherboard space utilization on the top
The motherboard has low utilization of space on its front part, which continues the MIX’s feature, top part in particular. The component density, as a whole, is low. That’s the reason for two phones’ large motherboard.

Xiaomi Mi MIX 2 heaat dissipation
The MIX’s utilization on motherboard’s space is a mess, while the MIX 2 has slightly improved on it. Material for cooling on the shielding case is covered with metal cooling paste. The MIX adopts S-shaped thermal silica on the thermal conductive paste, while the MIX 2 uses thermal silica gel. With such change, the MIX 2 has certain improvement on heat dissipation effect.

Xiaomi Mi MIX 2 internal design without motherboard

Here is the whole device without motherboard.

removing Xiaomi Mi MIX 2 earphone
Take out earphone on the top. The earphone looks the same with the Mate 10’s.

Xiaomi Mi MIX 2 vibrator
This vibrator is not big, but it is thicker than common rotor vibrator.

removing Xiaomi Mi MIX 2 screws at the bottom
The teardown on the top components is basically over. Now, remove the fixed screws at the bottom.

Xiaomi Mi MIX 2 loudspeaker
Although two phones’ loudspeakers are from AAC, the MIX 2’s loudspeaker has made some changes in its structure. But there is no big difference between their sound qualities.

removing Xiaomi Mi MIX 2 deputy board
Remove the deputy board, we can find that data port has adopted sealing design, and its front part is covered with thick rubber ring, which aims to enhance sealing effect.

Xiaomi Mi MIX 2 LED indicator
The LED indicator is on the right, and the ambient light sensor is supposed to be on the left.

Xiaomi Mi MIX 2 front camera
The front camera is mini and its parameter is 500W. This camera is estimated to be the MIX’s camera model.

removing Xiaomi Mi MIX 2 battery
Then remove the battery. The battery is fixed by two easy-to-pull stickers. The sticker is easy to break. After we take the picture, the sticker gets broken, and it drops under the battery, I suggest pull out the sticker slowly at slant 60 degree upward.

Xiaomi Mi MIX 2 battery
The MIX 2’s battery is provided by SCUD. The battery’s capacity is 3,400mAh, while the MIX’s battery capacity is 4,00mAh. The MIX 2’s battery supports 18W fast charging, which is far from reaching the standard that terminal device’ fast charging reaches. After all, current flagships basically sport the battery which supports over 20W fast charging. Of course I refer to Android phones exclude iPhones.

Easy-to-pull sticker
Easy-to-pull sticker still remains on the back.

 Xiaomi Mi MIX 2 main camera and front camera
There are the main camera and front camera. The main camera is much bigger than the front camera since it supports OIS function.

removing the metal heat dissipation paste
After remove the metal heat dissipation paste from the motherboard’s back, the Hynix memory chip can be seen. It can be inferred that the Snapdragon 835 chip is place under it.

PM8998 power management chip
The other small one with thermal silica is PM8998 power management chip.

remove a shielding case
What left on the back is welding shielding case, so I stop the teardown on the back. Now, let’s look at its front part, I can only remove a shielding case.

HP Pavilion 15-ck000 internal picture
Closeup picture of front motherboard.

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